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Linear Voltage Regulator 3.3 V Fixed Output Voltage
TLE 4275 V33
Feature Overview
* * * * * * * * * * * * * * Output voltage 3.3 V 2 % Current capability 400 mA Stable with ceramic output capacitor Reset circuit functional without supply voltage present Reset output active low down to VQ = 1 V Reset circuit sensing the output voltage with programmable delay time Maximum input voltage -42 V VI +45 V ESD Resistivity 4 kV (Human Body Model) Reverse polarity protection Short circuit protection Overtemperature shutdown Automotive temperature range -40 C Tj 150 C Green Product (RoHS compliant) AEC qualified
PG-TO252-5-11
The TLE 4275 V33 is a monolithic integrated low dropout fixed output voltage regulator for loads up to 400mA. An integrated reset generator with adjustable power-on delay time as well as several protection circuits predestine the IC for supplying microprocessor systems in an automotive environment.
Regulated Output Voltage
PG-TO263-5-1
+5V
Supply
I
TLE 4275 V33
Q
or: Reset Generator
Load e. g. Micro Controller
B o c k Di ag ra m_ A p p ircui t1.v sd l C
Protection Circuits GND
Bandgap Reference
RO
D CD
CQ
GND
Figure 1 Type
Simplified Block Diagram and Typical Application Package PG-TO252-5-11 (RoHS compliant) PG-TO263-5-1 (RoHS compliant) 1 Rev. 1.0, 2006-09-22
TLE 4275 D V33 TLE 4275 G V33 Datasheet
TLE 4275 V33
Pin Definitions and Functions
1
Pin Definitions and Functions
GND
1 RO DQ
5
GND Q D RO
IEP02528
AEP02580
PG-TO252-5-11
PG-TO263-5-1
Figure 2
Pin Assignment
Pin 1
Symbol I
Function Regulator Input and IC Supply. * For compensating line influences, a capacitor to GND close to the IC terminals is recommended. Reset Output. * Open collector output. External pull-up resistor to a positive voltage rail required. * Leave open if the reset function is not needed. PG-TO263-5-1 only: Ground Reference. * Connect to TAB and heatsink area Reset Delay Timing. * Connect a ceramic capacitor to GND for reset delay timing adjustment. * Leave open if the reset function is not needed. Regulator Output. * Block to GND with a capacitor close to the IC terminals, respecting capacitance and ESR requirements given in the table "Functional Range". PG-TO252-5-11 only: Ground Reference. * Connect to heatsink area. PG-TO263-5-1 only: * Connect to heatsink area and ground reference (pin 3).
2
RO
3 4
GND D
5
Q
TAB TAB
GND -
Datasheet
2
Rev. 1.0, 2006-09-22
TLE 4275 V33
Electrical Characteristics
2
2.1
Pos.
Electrical Characteristics
Absolute Maximum Ratings
Parameter Symbol Limit Values Min. Max. 45 - 16 - 25 5 7 2 - 150 150 4 500 V mA V mA V mA V mA mA C C kV V - - - Unit Conditions
-40 C Tj 150 C; all voltages with respect to ground (unless otherwise specified)
Regulator Input and IC Supply I 2.1.1 2.1.2 2.1.3 2.1.4 2.1.5 2.1.6 2.1.7 2.1.8 2.1.9 2.1.10 2.1.11 2.1.12 2.1.13 Moisture Level 2.1.14 Moisture Level Voltage Current Voltage Current Voltage Current Voltage Current Current Junction Temperature Storage Temperature ESD Resistivity
VI II VQ IQ VRO IRO VD ID IGND Tj Tstg VESD,HBM VESD,CDM MSL
-42 - -1 - -0.3 -5 -0.3 -2 - -40 -50 -4 -500 3
internally limited
-
Regulator Output Q
internally limited
-
Reset Output RO
Reset Delay Timing D
Ground GND
internally limited
- - HBM1) CDM2) -
Temperatures
ESD Susceptibility
1) ESD susceptibility, Human Body Model "HBM" according to EIA/JESD 22-A114B. 2) ESD susceptibility, Charged Device Model "CDM" according to EIA/JESD22-C101 or ESDA STM5.3.1
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation.
Datasheet
3
Rev. 1.0, 2006-09-22
TLE 4275 V33
Electrical Characteristics
2.2
Pos. 2.2.1 2.2.2 2.2.3 2.2.4
Functional Range
Parameter Input Voltage Junction Temperature Output Capacitor Symbol Limit Values Min. Max. 42 150 - 3 V C F 4.4 -40 22 - Unit Conditions / Remarks
VI Tj CQ ESRCQ
VQ = VI - Vdr 1)
- - 2)
-
1) For details on max. output current vs. input voltage see Table 1: Electrical Characteristics Voltage Regulator 2) The minimum output capacitance requirement is applicable for a worst case capacitance tolerance of 30%
Note: Within the functional range the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the related electrical characteristics table.
2.3
Pos.
Thermal Resistance
Parameter Symbol Typ. Value 144 78 55 Junction - Case PG-TO252-5-11 Rth,j-c Junction - Ambient PG-TO263-5-1 Junction - Case PG-TO263-5-1 1.8 79 53 39 Unit Conditions
Package P-TO252-5: 2.3.1 2.3.2 2.3.3 2.3.4 2.3.1 2.3.2 2.3.3 2.3.4 Package P-TO263-5: Junction - Ambient PG-TO252-5-11
Rth,j-a
K/W K/W K/W K/W K/W K/W K/W K/W
Footprint only1) 300 mm2 PCB heatsink area1) 600 mm2 PCB heatsink area1)
Rth,j-a
Footprint only1) 300 mm2 PCB heatsink area1) 600 mm2 PCB heatsink area1)
Rth,j-c
1.3
1) EIA/JESD 52_2, FR4, 80 x 80 x 1.5 mm; 35 Cu, 5 Sn; horizontal position; zero airflow. Not subject to production test; specified by design.
Datasheet
4
Rev. 1.0, 2006-09-22
TLE 4275 V33
Block Description and Electrical Characteristics
3
3.1
Block Description and Electrical Characteristics
Voltage Regulator
The output voltage VQ is controlled by comparing a portion of it to an internal reference and driving a PNP pass transistor accordingly. The control loop stability depends on the output capacitor CQ, the load current, the chip temperature and the poles/zeros introduced by the integrated circuit. To ensure stable operation, the output capacitor's capacitance and its equivalent series resistor ESR requirements given in the table "Operating Range" have to be maintained. For details see also the typical performance graph "Output Capacitor Series Resistor ESRCQ vs. Output Current IQ". Also, the output capacitor shall be sized to buffer load transients. An input capacitor CI is strongly recommended to buffer line influences. Connect the capacitors close to the IC terminals. Protection circuitry prevent the IC as well as the application from destruction in case of catastrophic events. These safeguards contain output current limitation, reverse polarity protection as well as thermal shutdown in case of overtemperature. In order to avoid excessive power dissipation that could never be handled by the pass element and the package, the maximum output current is decreased at input voltages above VI = 22 V. The thermal shutdown circuit prevents the IC from immediate destruction under fault conditions (e.g. output continuously short-circuited) by switching off the power stage. After the chip has cooled down, the regulator restarts. This leads to an oscillatory behaviour of the output voltage until the fault is removed. However, junction temperatures above 150 C are outside the maximum ratings and therefore significantly reduce the IC lifetime. The TLE 4275 V33 allows a negative supply voltage. However, several small currents are flowing into the IC increasing its junction temperature. This has to be considered for the thermal design, respecting that the thermal protection circuit is not operating during reverse polarity conditions For details see typical performance graphs.
Supply
I
Q
Regulated Output Voltage
Saturation Control Current Limitation C CI Temperature Shutdown Bandgap Reference ESR
}
CQ
LOAD
Blo c k Di a gram _Vol tag eReg ul a to r.v s d
GND
Figure 3
Block Diagram Voltage Regulator Circuit
Datasheet
5
Rev. 1.0, 2006-09-22
TLE 4275 V33
Block Description and Electrical Characteristics Table 1 Pos. 3.1.1 3.1.1 3.1.2 3.1.3 3.1.4 3.1.5 3.1.6 3.1.7 3.1.8 Load Regulation steady-state Line Regulation steady-state Power Supply Ripple Rejection Output Current Limitation dVQ,load dVQ,line Electrical Characteristics Voltage Regulator Parameter Output Voltage Symbol Limit Values Min. Typ. 3.3 3.3 3.3 -15 5 60 - - 25 Max. 3.37 3.37 3.37 - 15 - 1000 200 - V V V mV mV dB mA C K 1 mA IQ 400 mA; 5 V VI 28 V 1 mA IQ 300 mA; 4.4 V VI 28 V 1 mA IQ 200 mA; 4.4 V VI 40 V 3.23 3.23 3.23 -30 - - 401 151 - Unit Remark / Test Condition
VI = 13.5 V; -40 C Tj 150 C (unless otherwise specified)
VQ
PSRR IQ,max
IQ = 5 mA to 400 mA; VI = 6 V VI = 8 V to 32 V; IQ = 5 mA fripple = 100 Hz; Vripple = 0.5 Vpp 1) VQ = 3.0 V Tj increasing 1)
Overtemperature Shutdown Tj,sd Threshold Overtemperature Shutdown Tj,hy Threshold Hysteresis
1) Parameter not subject to production test; specified by design.
3.2
Table 2 Pos. 3.2.1 3.2.2 3.2.3 3.2.4
Current Consumption
Electrical Characteristics Current Consumption Parameter Current Consumption Symbol Min. Limit Values Typ. 180 180 8 20 Max. 220 240 12 30 A A mA mA - - - - Unit Conditions
VI = 13.5 V; -40 C Tj 150 C (unless otherwise specified)
Iq
Iq = IQ - II
IQ = 1 mA; Tj = 25 C IQ = 1 mA; Tj 85 C IQ = 250 mA IQ = 400 mA
Datasheet
6
Rev. 1.0, 2006-09-22
TLE 4275 V33
Block Description and Electrical Characteristics
3.3
Reset Function
The reset function contains serveal features: Output Undervoltage Reset: An output undervoltage condition is indicated setting the Reset Output "RO" to low. This signal might be used to reset a microcontroller during low supply voltage. In case the battery voltage is already lower than the buffered output voltage VQ of the voltage regulator, the reset circuit is supplied from the output "Q", ensuring a defined reset switching threshold also at VI = 0 V. The Reset Output "RO" is held "low" down to an output voltage of VQ = 1 V, even if the input voltage VI is 0 V. Power-On Reset Delay Time: The power-on reset delay time td,PWR-ON allows a microcontoller and oscillator to start up. This delay time is the time period from exceeding the reset switching threshold VRT until the reset is released by switching the reset output "RO" from "low" to "high". The power-on reset delay time td,PWR-ON is defined by an external delay capacitor CD connected to pin "D" which is charged up by the delay capacitor charge current ID,ch starting from VD = 0 V. For easy calculating the power-on reset delay time, a multiplier factor Fd,PWR-ON = td,PWR-ON / CD is specified. Hence, td,PWR-ON becomes:
td,PWR-ON = Fd,PWR-ON / CD .
For a precise calculation consider also the delay capacitor's tolerance. Undervoltage Reset Delay Time:
(1)
Unlike the power-on reset delay time, the undervoltage reset delay td time considers a short output undervoltage event where the delay capacitor CD is assumed to be discharged to VD = VDST,lo only before the charging sequence restarts. Therefore, the undervoltage reset delay time td is defined by the delay capacitor charge current ID,ch starting from VD = VDST,lo and the external delay capacitor CD. For easy calculating the undervoltage reset delay time, a multiplier factor Fd = td / CD is specified. Hence, td becomes:
td = Fd / CD .
For a precise calculation consider also the delay capacitor's tolerance. Reset Reaction Time:
(2)
The total reset reaction rime trr,total considers the internal reaction time trr,int and the discharge time trr,d defined by the external delay capacitor CD (see typical performance graph for details). Hence, the total reset reaction rime becomes:
trr,total = trr,int + trr,d .
Reset Output "RO" Low for VQ 1 V:
(3)
In case of an undervoltage reset condition reset output "RO" is held "low" for VQ 1 V, even if the input voltage VI is 0 V. This is achieved by supplying the reset circuit from the output capacitor.
Datasheet
7
Rev. 1.0, 2006-09-22
TLE 4275 V33
Block Description and Electrical Characteristics Reset Output "RO": The Reset Output "RO" is an open collector output requiring an external pull-up resistor to a voltage rail VIO. As the maximum Reset Output Sink Current IRO,max is limited, the minimum external pull-up resistor calculates:
RRO,external,min = VIO / IRO,max.
(4)
e.g. +5 V Supply I Q Int. Supply VDD
CQ ID,c h
RO
or Reset
Control
VRT
V DS T
MicroController
IDR,ds ch
GND
Blo c k Di a gra m _Res etSta nd ard _RO n op ul l up .v s d
D
GND
CD
Figure 4
Block Diagram Reset Circuit
V
VQ
< t rr V Q, rt d V D,c = dt CD
t
t V DU V DRL
VD
VRO
t rd
t rr
t
t Power-on-Reset Thermal Shutdown Voltage Dip at Input Undervoltage Secondary Spike Overload at Output
AED03010
Figure 5
Timing Diagram Reset
Datasheet
8
Rev. 1.0, 2006-09-22
TLE 4275 V33
Block Description and Electrical Characteristics Table 3 Pos. Pos. Electrical Characteristics Reset Function Parameter Parameter Symbol Min. Symbol Min. Output Undervoltage Reset Comperator: 3.3.1 3.3.2 3.3.3 Output Undervoltage Reset VRT1 Switching Threshold 3.06 2.5 100 3.13 2.9 130 3.2 V V mV Limit Values Typ. Typ. Max. Unit Conditions / Remarks Max. Limit Values Unit Conditions
VI = 13.5 V; -40 C Tj 150 C (unless otherwise specified)
VRT2
Output Undervoltage Reset VRH Headroom Reset Output Low Voltage Reset Output Sink Current Limitation Reset Output External Pull-up Resistor to VQ Reset Output Leakage Current Upper Delay Switching Threshold Lower Delay Switching Threshold
VRT1
-
VI 4.4 V VQ decreasing VI = 0 V VQ decreasing
Calculated Value: VQ,nom - VRT . VI 4.4 V 1 V VQ VRT ; IRO = 0.3 mA 1 V VQ < VRT ; VRO = 3.3V VRO 0.4 V at reset condition
Reset Output RO: 3.3.4 3.3.5 3.3.6 3.3.7
VRO,low IRO,max RRO IRO,leak
- 0.3 3.3 -
0.2 - - 0
0.4 - - 2
V mA k A
VRO = 5 V
Reset Delay Timing: 3.3.8 3.3.9
VDST,hi VDST,lo ID,ch IDR,dsch Fd
- - - - 0.13
1.8 0.6 6 70 0.20
- - - - 0.27
V V A mA ms / nF ms / nF s
- -
3.3.10 Delay Capacitor Charge Current 3.3.11 Delay Capacitor Reset Discharge Current 3.3.12 Undervoltage Reset Delay Time Factor Fd = td / CD 3.3.13 Power-on Reset Delay Time Factor Fd,PWR-ON = td,PWR-ON / CD 3.3.14 Delay Capacitor Discharge Time 3.3.15 Internal Reset Reaction Time
VD = 1 V VD = 1 V
Calculated Value: Fd = (VDST,hi - VDST,lo) / ID,ch CD 10 nF 1) Calculated Value: Fd = CD * VDST,hi / ID,ch CD 10 nF 1) Calculated Value: trr,d = CD*(VDST,hi - VDST,lo)/ ID,dsch CD = 47 nF
Fd,PWR-ON 0.21
0.30
0.39
trr,d
-
0.7
2
trr,int
-
2
6.5
s
CD = 0 nF 2)
1) For lower values of CD, the accuracy given is not guaranteed; see typ. performance graph for details. 2) Parameter not subject to production test; specified by design.
Datasheet
9
Rev. 1.0, 2006-09-22
TLE 4275 V33
Package Outlines
4
Package Outlines
6.5 +0.15 -0.05 5.7 MAX.
(4.24) 1 0.1
1)
A B
0.8 0.15
2.3 +0.05 -0.10 0.5 +0.08 -0.04
(5)
9.98 0.5 6.22 -0.2
0.9 +0.20 -0.01 0...0.15
0.51 MIN.
Footprint (Reflow Soldering)
10.6 6.4
5.8
0.34
0.8 5.36
0.15 MAX. per side
5 x 0.6 0.1 1.14
0.5 +0.08 -0.04 0.1 B
2.2

4.56
0.25 M A B
1) Includes mold flashes on each side. All metal surfaces tin plated, except area of cut.

Dimensions in mm Figure 6 PG-TO252-5-11 Package Outline and Footprint
4.4 10 0.2 0...0.3 8.5 1) A 1.27 0.1 B 0.05
Footprint (Reflow Soldering)
10.8
10.3
9.25 0.2
7.55 1)
(15)
2.7 0.3
5 x 0.8 0.1 4 x 1.7 0.25
M
0.5 0.1
4.6
0...0.15
4.7 0.5
16.15
9.4
2.4 0.1
0.6
AB
8 MAX.
0.1 B

1.1 7.9
1) Typical Metal surface min. X = 7.25, Y = 6.9 All metal surfaces tin plated, except area of cut.
GPT09113
Dimensions in mm Figure 7 PG-TO263-5-1 Package Outline and Footprint
Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pbfree finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
Find more package information on the Infineon Internet Page: http://www.infineon.com/packages.
Datasheet
10
Rev. 1.0, 2006-09-22
TLE 4275 V33
Revision History
5
Revision History
TLE 4275 V33 Revision History: Previous Version: 2006-09-22 n/a Rev. 1.0
Datasheet
11
Rev. 1.0, 2006-09-22
Edition 2006-09-22 Published by Infineon Technologies AG, 81726 Munich, Germany (c) Infineon Technologies AG 2006. All Rights Reserved. Attention please! The information given in this data sheet shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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